iCometrue Promotes Logic Drive in SEMICON TAIWAN 2023

iCometure participates in SEMICON TAIWAN 2023 (September 6^th ~ 8^th) for promoting Logic Drive, a device invented by the company. Exhibition includes items of Logic Drive, the advanced multi-chip packaging technology for use in Logic Drive, and the related invention and patents. You are welcome to visit our booth at L0805 on the 4^th floor of Nangang Exhibition Center Hall 1.

Logic Drive is a multi-chip package product containing one or multiple FPGA chiplets and a Non-Volatile Memory (NVM) chip. The FPGA chiplet is fabricated by the advanced semiconductor process technology more advanced than 10 nm. The NVM chip in the multi-chip package turns the Logic Drive into a non-volatile device by storing the programming codes for configuring the FPGA chiplet. Logic Drive is like the Solid-State Drive (SSD); the difference is that SSD stores data memory, while Logic Drive stores computing logic. An innovative IC designer may implement his innovations cost-effectively by programming his innovation into Logic Drive, put his own logo on Logic Drive, and sell it as an ASIC chip.

Logic Drive invented by iCometure provides a Public Innovation Platform for the 99% of common public to participate in the game of the wealthy 1%, thereby revealing the full potential and power of technology more advanced than 10nm. Moreover, Logic Drive is a re-useable product, contributing to environmental sustainability.

In last seven years, iCometrue has intensively layout the roadmap to Logic Drive, proposing methods to standardize the FPGA chiplets for cost reduction and inventing advanced multi-chip packaging technology for packaging Logic Drive. As now, iCometrue has been awarded 36 US patents. The primary objective of participating in this exhibition is to seek partners for collaborative development and production of Logic Drive. Alternatively, the company is open to patent licensing, encouraging possible manufacturers to develop and produce Logic Drive.

Furthermore, based on years of research and observation in multi-chip packaging technology, Dr. Lin unveils the concept of "Moore's Law of Chip Package" for the first time. The Moore's Law of chip states that the number of transistors in a unit area doubles every 18-24 months. While the chip packaging technology was once considered as "non-Moore's Law", Dr. Lin proposes that the chip packaging technology will also start to undergo a similar trend of size miniaturization, following the well-known Moore's Law of chip. This implies that every 18-24 months, the number of transistors within a unit volume of chip package will double. When combining with Moore's Law of chip, the number of transistors in the multi-chip package will double sooner in every 9-12 months.

The Moore's Law of chip now faces challenges related to physical limitations and escalating costs, and gradually slows down. As a result, the miniaturization journey is turning towards the chip packaging technology. In the future, the chip packaging technology is anticipated to progressively take the lead and continue the Moore's Law.

Also exhibited is Dr. Lin's new book, "Moore's Journey: The Magical Power of Big Numbers", just published and released in late August. The book provides a comprehensive explanation of Logic Drive and Moore's Law of Chip Package. You are welcomed to take a look at the book.